Quectel RM520N-GL 5G Module

The Quectel RM520N-GL is a high-performance 5G Sub-6GHz M.2 wireless module built on the Qualcomm SDX62 platform, designed for next-generation IoT and enhanced mobile broadband (eMBB) applications. Compliant with the 3GPP Release 16 specification, this module delivers blazing-fast connectivity with support for both 5G Non-Standalone (NSA) and Standalone (SA) network architectures. Whether you are building a portable 5G router, an edge computing gateway, a mobile surveillance system, or any bandwidth-intensive embedded device, the RM520N-GL provides the cellular backbone you need.

At its core, the RM520N-GL achieves remarkable data throughput. On the downlink, the module is capable of speeds up to 3.4 Gbps under 5G NR Sub-6GHz, while uplink speeds reach up to 900 Mbps. In NSA mode the module delivers up to 3.2 Gbps downlink and 600 Mbps uplink. Even when falling back to LTE-Advanced networks the module maintains excellent performance with Cat 20 downlink speeds of up to 2.0 Gbps and Cat 18 uplink speeds of up to 200 Mbps, ensuring seamless connectivity in mixed network environments where 5G coverage is still being deployed.

The RM520N-GL offers truly global frequency band coverage. For 5G NR it supports bands n1, n2, n3, n5, n7, n8, n12, n13, n14, n20, n25, n26, n28, n29, n30, n38, n40, n41, n48, n66, n70, n71, n75, n76, n77, n78, and n79. On the LTE side it covers FDD bands B1 through B71 and TDD bands B34 through B48, including LAA on B46. Legacy WCDMA fallback is available on bands B1, B2, B4, B5, B8, and B19. This extensive band support means the module works with virtually every major carrier across North America, Europe, Asia-Pacific, and beyond, making it an ideal choice for products that ship worldwide.

Advanced MIMO antenna technology is a standout feature of the RM520N-GL. The module supports 4x4 MIMO on the downlink and 2x2 MIMO on the uplink for Sub-6GHz 5G NR, maximizing spectral efficiency and signal reliability. Combined with carrier aggregation support, this ensures consistently high throughput even in congested cell environments or at the edge of coverage areas. For applications requiring precise location tracking the module integrates a multi-constellation GNSS receiver supporting GPS, GLONASS, BeiDou, Galileo, and NavIC satellite systems with both active and passive antenna configurations.

Physically the RM520N-GL uses the industry-standard M.2 form factor measuring 52.0 x 30.0 x 2.3 mm, making it compatible with a wide range of carrier boards and embedded platforms including the Photonicat 2. The module interfaces via USB 3.1 Gen 1 and PCIe 3.0, giving system designers flexibility in how they integrate high-speed data paths. A nano-SIM card slot provides traditional SIM connectivity, while optional eSIM support enables remote SIM provisioning for fleet deployments where physical SIM swaps are impractical.

The module operates on a supply voltage range of 3.135V to 4.4V with a typical voltage of 3.7V. It is rated for an operating temperature range of -30 degrees C to +70 degrees C in the standard configuration, with an extended temperature option covering -40 degrees C to +85 degrees C for harsh industrial environments. This wide thermal range ensures reliable operation in outdoor enclosures, vehicles, industrial facilities, and other challenging deployment scenarios.

Voice over LTE (VoLTE) is available as an optional feature, along with DTMF tone generation, enabling the module to serve in applications that require voice calling capabilities alongside data. Delta Firmware Over-The-Air (DFOTA) support allows remote firmware updates, reducing maintenance costs for large-scale deployments by eliminating the need for on-site visits to update module firmware.

Quectel has ensured broad regulatory compliance for the RM520N-GL. The module carries certifications from GCF, PTCRB, FCC (United States), IC (Canada), CE (Europe), CCC (China), and RCM (Australia), as well as carrier approvals from T-Mobile, AT&T, and other major operators. This means faster time-to-market for your product without the delays and expense of individual module-level regulatory testing.

The RM520N-GL also supports 3GPP Release 16 advanced features including 5G network slicing, which allows operators to create dedicated virtual network partitions optimized for specific use cases such as ultra-reliable low-latency communication (URLLC) or massive machine-type communication (mMTC). This makes the module future-proof for enterprise and industrial IoT deployments that demand guaranteed quality of service.

This module is sold as a standalone M.2 card. It is fully compatible with the Photonicat 2 and can be installed in the internal M.2 B-Key slot. If purchased together with a Photonicat 2, we will install it for you free of charge. The module ships with thermal pad and mounting hardware included.